- Asymmetric Heat Pipe Array
- Vortex Generator Flow (VGF)
- Vaccum Effect Flow (VEF)
- Heat Pipe Direct Touch (HDT)
- 25% Lower Noise
- 1-Clip Fan Bracket
- Dow Corning TC-5121 Thermal Grease
- Universal Back Plate Design

Specifications
- Compatible Sockets:
* Intel LGA 775/1150/1151/1155/1156/1366/2011/2011-3
* AMD AM2/AM2+/AM3/AM3+/FM1/FM2/FM2+
- Overall Dimensions (L×W×H): 95×77.5×137.2 mm
- Heat Sink Dimensions (L×W×H): 92×50×137.2 mm
- Number / Thickness of Heat Pipes: 3x 6 mm
- Thermal Design Power (TDP): 150W
- Weight (without fan): 300g
- Material: Copper Heat Pipes / Aluminium Fins
- Thermal Grease: Dow Corning TC-5121

FAN
- Fan Model: High-Efficient 9cm Fan
- Fan Dimensions: 92×92×25 mm
- Fan Speed:
* 800 - 2.800 rpm
* 600 - 1.800 rpm (with RPM adapter)
- Air Flow:
* 27 - 94.1 m3/h
* 15.9 - 52.3 m3/h (with RPM adapter)
- Air Flow:
* 15.9 - 55.4 CFM
* 9.3 - 30.8 CFM (with RPM adapter)
- Static Pressure:
* 0.36 - 4.37 mm-H2O
* 0.18 - 1.7 mm-H2O (with RPM adapter)
- Noise Level:
* 16 - 28 dB(A)
* 12 - 20 dB(A) (with RPM adapter)
- Rated Voltage: 12 V
- Fan connector: 4-pin PWM
- Fan Mounting: 1-Clip Bracket

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